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Thermal Applications:
Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature
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TN-00-08
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05/2010
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252.18 KB
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Technical Note
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Uprating of Semiconductors for High-Temperature Applications:
Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications
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TN-00-18
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05/2010
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428.33 KB
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Technical Note
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Understanding Signal Integrity:
Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life
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TN-00-20
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12/2009
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1.52 MB
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Technical Note
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PCN/EOL Systems:
Explains Micron's product change notification and end-of-life systems.
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CSN-12
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08/2009
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75.58 KB
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Customer Service Note
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Wafer Packaging and Packaging Materials:
Provides complete shipping and recycling information about each of the materials used for shipping Micron's products.
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CSN-20
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09/2011
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776.24 KB
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Customer Service Note
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Bare Die SiPs and MCMs:
Describes design considerations for bare die SiPs and MCMs.
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CSN-18
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04/2009
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151.06 KB
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Customer Service Note
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Shipping Quantities:
Provides tables of part quantity.
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CSN-04
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10/2011
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463.55 KB
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Customer Service Note
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Micron Component and Module Packaging:
Explanation of Micron packaging labels and procedures.
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CSN-16
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02/2012
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840.61 KB
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Customer Service Note
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ESD Precautions for Die/Wafer Handling and Assembly:
Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs.
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CSN-24
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08/2010
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119.08 KB
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Customer Service Note
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Electronic Data Interchange:
Describes EDI transmission sets, protocol, and contacts.
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CSN-06
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09/2005
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53.5 KB
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Customer Service Note
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RMA Procedures for Packaged Product and Bare Die Devices:
Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs.
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CSN-07
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10/2010
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82.64 KB
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Customer Service Note
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ISO System Management Standards:
Describes ISO system management standards.
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CSN-08
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04/2004
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39.18 KB
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Customer Service Note
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Accelerate Design Cycles with Simulation Models:
Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design.
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TN-00-09
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02/2010
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206.91 KB
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Technical Note
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Introduction to On-Board Programming with Numonyx Flash Memory:
This application note describes the strengths, limitations, programming methods, and design considerations for on-board programming of NOR Flash memory devices.
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AN-624
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11/2010
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87.42 KB
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Technical Note
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Simplify Manufacturing by Using Automatic-Test-Equipment for On-Board Programming:
This document describes using automatic-test-equipment (ATE) to program Numonyx NOR Flash memory components on a PCB.
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AN-629
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11/2010
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440.67 KB
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Technical Note
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How to Migrate from the M95 SPI EEPROM to the M25PE SPI Serial Flash:
This application note describes how to migrate from the M95 family of SPI EEPROMs to the M25PE family of SPI Serial Flash memories.
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AN-2081
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11/2010
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314.02 KB
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Technical Note
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Using XIP Modes in the Forte N25Q Flash Memory Device:
This technical note explains how to implement eXecute in Place (XiP) functionality in an application based on the Numonyx Forte N25Q Flash memory device family.
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TN-12-07
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04/2011
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213.9 KB
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Technical Note
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How to Migrate from Numonyx M25P128 130nm to 65nm Serial Flash:
This application note explains how to migrate an application based on the Numonyx M25P128 (130nm) to Numonyx M25P128 (65nm) serial Flash memory device.
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AN-309026
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11/2010
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49.9 KB
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Technical Note
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Micron Wire-Bonding Techniques:
This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products.
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TN-00-22
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11/2010
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66.13 KB
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Technical Note
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Comparing Micron N25Q and Winbond W25Q Flash Devices:
Tech Note Comparing Micron N25Q and Winbond W25Q Flash Devices
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TN-12-17
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07/2011
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201.88 KB
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Technical Note
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Comparing Micron N25Q and SST SST26WF Flash Devices:
Tech Note Comparing Micron N25Q and SST SST26WF Flash Devices
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TN-12-16
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07/2011
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191.82 KB
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Technical Note
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Comparing Micron N25Q and Spansion S25FL Flash Devices:
Technical Note Comparing Micron N25Q and Spansion S25FL Flash Devices
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TN-12-15
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07/2011
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197.96 KB
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Technical Note
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Comparing Micron N25Q and Macronix MX25L Flash Devices:
Technical Note Comparing Micron N25Q and Macronix MX25L Flash Devices
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TN-12-14
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07/2011
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203.35 KB
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Technical Note
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Comparing Micron N25Q and M25PX Flash Devices:
Tech Note Comparing Micron N25Q and M25PX Flash Devices
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TN-12-13
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07/2011
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187.87 KB
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Technical Note
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Comparing Micron N25Q and M25P Flash Devices:
Tech Note Comparing Micron N25Q and M25P Flash Devices
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TN-12-12
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07/2011
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194.67 KB
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Technical Note
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Serial NOR Flash Flyer:
Whether you need to simplify your design with industry-standard features or develop a long-term solution for a legacy platform, our serial NOR Flash provides fast access times, secure data storage, and architectural flexibility for your product design requirements.
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Product Flyer
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02/2012
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617.12 KB
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Product Flyer
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Migrating from Atmel AT45DB011D to Micron M45PE10 Flash Devices:
This technical note describes the process for migrating from the Atmel Serial NOR Flash Memory device (AT45DB011D) to the Micron Serial NOR Flash memory device (M45PE10).
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TN-12-09
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05/2011
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198.99 KB
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Technical Note
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Industrial and Multi-Market Applications Flyer:
Our extensive and stable portfolio of IMM-focused memory solutions empower technology developments in automotive, industrial, medical, manufacturing, and other multi-market segments.
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Product Flyer
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08/2011
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593.95 KB
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Product Flyer
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Migrating N25Q 3V, 128Mb Device:
This technical note explains how to migrate from the Micron® N25Q 3V, 128Mb parameter blocks serial NOR Flash device to the N25Q 3V, 128Mb uniform, subsector erase serial NOR Flash device.
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TN-12-10
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06/2011
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244.77 KB
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Technical Note
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Lead Frame Package User Guidelines:
Discusses Micron's lead-frame package options
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CSN-30
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05/2011
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245.66 KB
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Customer Service Note
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Micron BGA Manufacturer's User Guide:
Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices.
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CSN-33
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07/2011
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353.32 KB
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Customer Service Note
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Migrating from Macronix MX25L25635E to Micron N25Q 256Mb Flash:
Compares the features of the Macronix MX25L25635E and Micron N25Q (256Mb)Flash memory devices.
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TN-12-18
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12/2011
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226.89 KB
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Technical Note
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Product Marks/Product and Packaging Labels:
Explains product part marking, and product and packaging labels.
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CSN-11
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02/2012
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666.83 KB
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Customer Service Note
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Flash Data Integrator (FDI) File System Flyer:
Running on Micron's latest NOR Flash and phase change memory (PCM), our Flash Data Integrator (FDI) file system provides dependable storage to create a compelling, low-cost solution. In addition, FDI delivers a true eXecute-in-Place (XiP) advantage in an open architecture to manage code and data in NOR and PCM memory devices.
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Product Flyer
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09/2011
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673.02 KB
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Product Flyer
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Compatibility Guide for Micron Software Device Drivers Available on micron.com:
This document lists the compatible NOR, NAND, and PCM devices for the software device drivers available for download from micron.com.
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Product Flyer
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02/2012
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227.69 KB
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Product Flyer
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Bypass Capacitor Selection for High-Speed Designs:
Describes bypass capacitor selection for high-speed designs.
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TN-00-06
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03/2011
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481.9 KB
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Technical Note
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Password Protecting Flash Memory Blocks:
This document describes a method of password protecting blocks using Micron's M29EW device as an example.
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TN-12-05
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03/2011
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404.22 KB
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Technical Note
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Software Device Drivers for Micron's N25Q Serial NOR Flash Memory:
This technical note provides a description of the C library source code for Micron N25Q serial NOR Flash memory devices.
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TN-12-11
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02/2012
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413.05 KB
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Technical Note
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Migrating from Spansion's S25FL256S to Micron's N25Q 256Mb Flash:
Compares features of Micron's 256Mb N25Q and Spansion's S25FL256S Flash memory devices
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TN-12-19
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12/2011
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243.71 KB
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Technical Note
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