PSRAM CellularRAM

PSRAM

Boost Mobile Performance and Value

Our CellularRAM® memory combines low power consumption and high speed for your mobile designs.

Merge SignMerging the Best of DRAM and SRAM

CellularRAM® memory is a pseudo-static DRAM (PSRAM) device that features an SRAM-like architecture, hidden refresh operation, and SRAM pin-compatibility. This hybrid memory delivers the best of SRAM and DRAM features, combining low power consumption and high-speed read and write functions. Because CellularRAM memory also offers synchronous operations, fast access, and variable latency initial burst access, you get high throughput and excellent performance. It's an ideal solution for low-power, space-limited designs like MCPs, as well as mobile and industrial applications.

CellularRAM Part Catalog and Documentation


Compatibility and Ease of Design
Our CellularRAM memory is compatible with the standard wireless Flash interface, and it's easy to use in an MCP with burst Flash memory. It also uses the same voltage range, package options, and ball assignments as standard SRAM, making CellularRAM memory an easy decision—and an even easier transition, saving you design time.

Power-Saving Features
With CellularRAM memory, you can boost the battery life in virtually any mobile or power-sensitive application that currently uses SRAM. It relies on several power-saving modes to consume less power than standard DRAM. Temperature-compensated refresh (TCR) adjusts the refresh rate based on ambient temperatures. Partial-array refresh (PAR) only uses power where and when it’s needed. And deep power-down (DPD) doesn’t waste power when the device isn’t in use.

Other Key Benefits

High Density From a Tiny Die
DRAM architecture enables high densities to be manufactured in a relatively small die without compromising quality or performance.

Design Compatibility
Reduced debug time and design reuse gets you to market quicker.

Variable Latency
Cuts access time in half, making first data available in as little as 35ns.

Fixed Latency
Enables compatibility with older systems.

Adjustable Output Drive
Provides the ability to tune outputs to match system impedance and minimize noise and power

Features Benefits
Densities 16–128Mb A range of densities, provides flexibility for many designs
Configuration x16 Available in x16 word sizes with selectable bytes and burst lengths
Supply Voltages 1.7–1.95V core
1.7–3.3V I/O
1.7–3.6V I/O
A single device that can operate over an extended Vccq range
Power Consumption ISB = 30µA (TYP)
ICC1 = 15mA (TYP)
Offers extremely low power dissipation in standby and active modes; PAR in standby mode provides even greater power savings
Temperature Ranges -30C to +85C
-40C to +95C
-40C to +105C
Wide temperature ranges are ideal for rugged mobile and industrial environments
Packages 48-, 54-ball VFBGA Perfect for space-limited mobile applications

What is CellularRAM® Memory?

Our CellularRAM memory is pseudo-static DRAM with an asynchronous/page and burst interface, hidden refresh operation, and SRAM pin compatibility, which makes it a convenient and effective solution, designed specifically for mobile applications.

DRAM is a specific kind of random access memory that is  structurally simple—typically with one or two transistors and capacitors per bit—and it refreshes a memory cell's charge at regular intervals. Like DRAM, CellularRAM memory stores one bit of information in each of its millions of memory cells and refreshes these memory cells at regular intervals. But like SRAM, CellularRAM devices don't require external refresh support and use less power than standard DRAM.

If you want specific information about moving from SRAM to CellularRAM memory, including a discussion of power supply considerations, ball assignments, controller interface, and configurations, read our tech note,
TN-45-17: CellularRAM® Devices Replacing Single- and Dual-CE# SRAM.


Burst A/D MUX CellularRAM® for Cost-Sensitive Mobile Markets

Our burst A/D MUX CellularRAM pseudo-static DRAM leverages all of the key performance advantages of our CellularRAM memory, but with a 30% reduction in controller pin count, simplifying controller designs, lowering system design costs, and shortening design-cycle times. Burst A/D MUX products are the perfect memory solution for handsets targeted at emerging markets and other battery-powered applications where low power consumption is an important consideration. We offer our burst A/D MUX products in die form because they make excellent companion devices for NOR Flash and are ideal for MCPs.

We've also prepared several technical notes to help you make a good decision about integrating a burst A/D MUX device into your next design.

Type Secure Title & Description ID# Updated Size
Functional Differences Between CellularRAM 1.0 and CellularRAM 1.5 :  Discusses the functional difference between the CellularRAM 1.0 and CellularRAM 1.5 memory devices TN-45-01 08/2005 141.07 KB
CellularRAM Asynchronous and Mixed-Mode Slow-Clock WRITE Concerns:  Discusses the use of Micron CellularRAM-based devices in Mixed Mode operation and slow clock speeds TN-45-02 05/2005 100.22 KB
CellularRAM Multiplexed Async/Burst Operation:  Discusses multiplexing a non-multiplexed CellularRAM device at the substrate level TN-45-04 01/2009 687.75 KB
Density Migration for x16 Burst Multiplexed PSRAM Introduction:  Discusses the design differences to account for when migrating a burst multiplexed device from 16Mb to 64Mb TN-45-06 01/2006 65.9 KB
Implementing CellularRAM 2.0, x32 with Two CellularRAM 1.5 x16 Devices:  Documents how the x32 CR2.0 memory interface can be emulated using a two-die stack of x16 CR 1.5 devices TN-45-07 12/2006 107.52 KB
64Mb Async/Page CellularRAM P25A to P25Z Transition Guide:  Discusses migrating a design based on the async/page MT45W4MW16P (P25A) to the MT45W4MW16PC (P25Z) TN-45-08 10/2005 52.89 KB
64Mb Burst CellularRAM P25A to P25Z Transition Guide:  Discusses migrating a design based on the async/page/burst MT45W4MW16B (P25A) to MT45W4MW16BC (P25Z) TN-45-09 10/2005 64.45 KB
Designing Applications with the x16 Burst A/D Multiplexed Interface:  Discusses the differences between a burst non-A/D MUX and burst A/D MUX device TN-45-10 11/2005 83.73 KB
Using CellularRAM Memory to Replace UtRAM :  Assists migration from a 128Mb UtRAM design (K1B2816B6M) to Micron 128Mb CellularRAM memory (MT45W8MW16B). Both hardware and software changes are covered TN-45-13 01/2006 195.88 KB
Using CellularRAM Memory to Replace Fujitsu 3V FCRAM:  Discusses replacing Fujitsu 3V FCRAM with Micron CellularRAM memory TN-45-14 02/2006 195.22 KB
Row Boundary Crossing Functionality in CellularRAMâ„¢ Memory:  Explains row boundary crossing in Micron CellularRAM memory devices TN-45-15 11/2009 524.87 KB
Using CellularRAM Memory to Replace Fujitsu 1.8V FCRAM:  Discusses replacing Fujitsu 1.8V FCRAM with Micron CellularRAM memory TN-45-16 03/2006 208.91 KB
Using CellularRAM Memory to Replace Single- and Dual-Chip Select SRAM:  Discusses migrating a single- or dual-chip select SRAM design to Micron CellularRAM memory. Both hardware and software changes are covered. TN-45-17 01/2007 179.87 KB
Using CellularRAM Memory to Replace NEC Mobile Specified RAM (PD46128512):  Discusses migrating a 128Mb NEC Mobile Specified RAM design (PD46128512) to Micron 128Mb CellularRAM memory (MT45W8MW16B). Both hardware and software changes are covered. TN-45-18 03/2006 228.87 KB
Low-Power Options for Async/Page CellularRAM:  Discusses the low-power options available to customers on async/page CellularRAM memory devices TN-45-20 05/2006 197.19 KB
Variable vs. Fixed Latency CellularRAM Operation:  This technical note assists designers in understanding the differences between CellularRAM variable and fixed latency operations TN-45-22 07/2006 122.39 KB
Using CellularRAM Memory on a NOR FLASH Bus:  Discusses design considerations when placing a CellularRAM memory device on a NOR Flash bus TN-45-23 07/2006 391.96 KB
Fixed-Latency Operation in CellularRAM 1.0 Devices:  Details how Micron has enhanced CellularRAM CR1.0 functionality TN-45-24 08/2006 187.66 KB
Using Micron Asynchronous PSRAM with ADI ADSP-BF53x Blackfin Processors:  Describes the design requirements for a seamless memory connection between Analog Devices Blackfin processors and Micron 70ns, 8Mb asynchronous PSRAM devices TN-45-27 06/2007 265.86 KB
Using a Micron CellularRAM Device with the AMCC PPC405EZ Embedded Processor:  Describes the design requirements for a seamless memory connection between the PPC405EZ and a Micron CellularRAM device TN-45-28 02/2006 288.01 KB
Using Micron Asynchronous PSRAM with the NXP LPC2292 and LPC2294 Microcontrollers:  Describes the design requirements for a seamless memory connection between the NXP LPC2292 and LPC2294 family of microcontrollers and a Micron asynchronous PSRAM device TN-45-29 06/2007 255 KB
PSRAM 101: An Introduction to Micron CellularRAM and PSRAM:  Demonstrates PSRAM and CellularRAM memory advantages over other memory options for use in mobile handsets; and presents available configurations TN-45-30 05/2008 351.24 KB
Connecting Micron CellularRAM Devices with the Atmel Microcontroller:  Describes the preferred methods for connecting Micron CellularRAM devices to the Amtel microcontroller TN-45-33 06/2008 525.62 KB
IBIS Behavioral Models:  Micron has been a member of the IBIS Open Forum for many years and fully supports the IBIS specification. IBIS models for most Micron products are available for download from the Micron Web site. TN-00-07 11/2009 163.98 KB
Thermal Applications:  Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature TN-00-08 05/2010 252.18 KB
Understanding Quality and Reliability Requirements for Bare Die Applications:  Describes the quality and reliability requirements for bare die applications TN-00-14 10/2009 152.83 KB
Recommended Soldering Parameters:  Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. TN-00-15 03/2007 69.09 KB
Uprating of Semiconductors for High-Temperature Applications:  Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications TN-00-18 05/2010 428.33 KB
Understanding Signal Integrity:  Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life TN-00-20 12/2009 1.52 MB
SEMI Wafer Map Format:  Micron has adopted the wafer map file format approved by Semiconductor Equipment and Materials International (SEMI). With SEMI formatting, Micron's customers can be confident they will always receive consistent, compatible, reliable map files. TN-00-21 02/2009 110 KB
Thinning Considerations for Wafer Products:  Information on optimal wafer-thinning processes to meet specific customer requirements TN-00-19 10/2009 73.58 KB
Hands-On Electronics Education:  Read how Micron partnered with Digilent to develop inexpensive and yet powerful digital system design boards. 12/2009 1.05 MB
PSRAM and CellularRAM Part Numbering System:  Part numbering guide for Micron PSRAM and CellularRAM products. 12/2008 28.52 KB
PCN/EOL Systems:  Explains Micron's product change notification and end-of-life systems. CSN-12 08/2009 75.58 KB
Wafer Packaging and Packaging Materials:  Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 09/2011 776.24 KB
Bare Die SiPs and MCMs:  Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 151.06 KB
Shipping Quantities:  Provides tables of part quantity. CSN-04 10/2011 463.55 KB
Micron KGD Definitions:  Describes the testing specifications and parameters for Micron's KGD-C1 and KGD-C2 DRAM die. CSN-22 07/2009 65.52 KB
Proper Handling Procedures for Modules:  Includes procedures for how to properly handle modules. CSN-23 12/2007 1.02 MB
Micron Component and Module Packaging:  Explanation of Micron packaging labels and procedures. CSN-16 02/2012 840.61 KB
ESD Precautions for Die/Wafer Handling and Assembly:  Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 119.08 KB
Electronic Data Interchange:  Describes EDI transmission sets, protocol, and contacts. CSN-06 09/2005 53.5 KB
RMA Procedures for Packaged Product and Bare Die Devices:  Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 10/2010 82.64 KB
ISO System Management Standards:  Describes ISO system management standards. CSN-08 04/2004 39.18 KB
The Future of Memory and Storage:  Overview of trends for main memory and Flash memory 12/2009 1.54 MB
DRAM Component Part Numbering System:  Part numbering guide for DDR3/DDR2/DDR/SDR SDRAM, Mobile LPDRAM, and RLDRAM components 02/2012 39.77 KB
FBGA Date Codes:  Date codes for FBGA-packaged components 08/2005 22.36 KB
Accelerate Design Cycles with Simulation Models:  Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design. TN-00-09 02/2010 206.91 KB
Design Guide - Dealing with DDR2/DDR3 Clock Jitter:  Explores DDR2/DDR3 clock jitter specifications and provides guidance on how to apply them and how to deal with violations TN-04-56 09/2008 272.53 KB
Micron Wire-Bonding Techniques:  This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products. TN-00-22 11/2010 66.13 KB
Burst A/D MUX CellularRAM Memory Flyer:  Describes how reduced pin count CellularRAMâ„¢ memory can save design time and lower cost 08/2009 141.19 KB
Industrial and Multi-Market Applications Flyer:  Our extensive and stable portfolio of IMM-focused memory solutions empower technology developments in automotive, industrial, medical, manufacturing, and other multi-market segments. Product Flyer 08/2011 593.95 KB
Micron BGA Manufacturer's User Guide:  Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 07/2011 353.32 KB
CellularRAM PSRAM Flyer:  Describes how CellularRAM PSRAM is an ideal, drop-in replacement for SRAM 08/2009 200.76 KB
Product Marks/Product and Packaging Labels:  Explains product part marking, and product and packaging labels. CSN-11 02/2012 666.83 KB
Bypass Capacitor Selection for High-Speed Designs:  Describes bypass capacitor selection for high-speed designs. TN-00-06 03/2011 481.9 KB

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What are the benefits of CellularRAM technology?
CellularRAM technology's multiple benefits include:
  • backward compatibility with standard asynchronous SRAM devices
  • DRAM technology with an SRAM interface
  • higher densities and performance
  • lower cost per bit than current SRAM devices
What are the specific features that distinguish the CellularRAM family from existing SRAM architectures?
6T-SRAM is most commonly used in densities of 2/4/8Mb in cell phone designs. It features 70ns/85ns random cycle times with a bandwidth of ~30 MB/s in a x16 configuration. Active power consumption at 1.8V is 25mA. CellularRAM devices significantly exceed today’s low-power 6T-SRAM in density and bandwidth, while keeping active power consumption at equally low levels. CellularRAM products feature a random cycle time of 70ns at 1.8V, and allow a peak bandwidth of 208 MB/s in burst mode.
What are the target markets and applications for CellularRAM devices?
CellularRAM products target handsets, but can be used anywhere cache or buffered memory is required.
What densities and configurations of CellularRAM does Micron offer?
Micron offers 16Mb, 32Mb, 64Mb and 128Mb densities in the Async/Page and Async/Page/Burst configurations. Micron offers all densities of CellularRAM in wafer form as KGD (Known Good Die). In wafer form, Micron also offers the Burst A/D multiplexed configuration.
What is CellularRAM memory?
CellularRAM memory is a family of pseudo-SRAM (PSRAM) products that are backward compatible with 6T (six-transistor) SRAM and early generation Async or Page PSRAM. CellularRAM offers a complete new set of devices with innovative functionality burst, providing an evolutionary path to pseudo SRAM.