RDIMM

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Memory for the Global Infrastructure

Registered DIMMs are a mainstream memory module solution that powers thousands of successful designs worldwide

data plane

RDIMM Innovation for Many Applications

Industry-Leading Reliability
Our RDIMMs are built with what may be the industry’s most reliable memory components. RDIMM features like registers, buffers, and ECC help ensure data integrity at both the device and the system level.

 

RDIMM Part Catalogs and Documentation

Dozens of Density Options
Because our RDIMMs represent the mainstream of module production and development, we can offer them in an extremely wide range of densities, from 128MB to 16GB.

Extended Temperature Range
Our RDIMMs have a wide operating range, including some that work at temperatures of 0°C to +95°C, helping your application can thrive in rugged environments.

RoHS Options
Of course we offer RoHS 6/6-compliant RDIMMs; but did you know we also maintain a full set of 5/6-compliant products for industries that have exempt applications to providing the solutions you need when you need them.

Sim Models and Other Online Design Support
As a Micron customer, you have access to some of the industry’s most experienced field applications engineers, but we also offer a host of time-saving support tools free online, including:
  • Easy-to-use data sheets
  • Detailed technical notes
  • Simulation models
  • Online development tools (like SPD data tables)
Our thermal and electrical sim models let you validate module options to see what works best for your design. And because our data sheets are built on the latest XML-based authoring technology, we can deliver some of the most timely and accurate documentation in the semiconductor business. See specific module part pages for individual documents and tools.


Dependable Quality
We build memory modules from start to finish—beginning with memory component design—carefully testing at each stage of the manufacturing process. We work with board makers and industry organizations to define and develop the leading technologies. Our involvement at every stage of memory development and manufacture means you'll consistently receive top-quality modules.

Features Benefits
Wide Density Range 128MB–16GB
Flexible Configuration Available single- or dual-rank support
PLL Provides better signal integrity to each component on the module
Simulation Models Our convenient thermal and electrical simulation models are available online for easy download

Type Secure Title & Description ID# Updated Size
Thermal Applications:  Defines a general method and criteria for measuring and ensuring that Micron components and modules do not exceed the maximum allowable temperature TN-00-08 05/2010 252.18 KB
Recommended Soldering Parameters:  Defines the recommended soldering techniques and parameters for Micron Technology, Inc., products. TN-00-15 03/2007 69.09 KB
Uprating of Semiconductors for High-Temperature Applications:  Describes the issues associated with temperature uprating and the risks involved in using components and/or systems outside the manufacturer's environmental specifications TN-00-18 05/2010 428.33 KB
Understanding Signal Integrity:  Describes how memory design, test, and verification tools can be used to the greatest advantage, from conception of a new product through end of life TN-00-20 12/2009 1.52 MB
Memory Module Serial Presence-Detect:  Describes how SPD is essential in helping to standardize the configuration, timing, and manufacturing information of memory modules TN-04-42 12/2009 505.83 KB
Comparing Module Parameters:  Compares module parameters. TN-04-49 03/2003 52.71 KB
High-Speed DRAM Controller Design:  Identifies and discusses five key areas of DRAM controller design TN-04-54 04/2008 1 MB
DRAM Module Form Factors:  Compares the most common DRAM module form factors TN-04-55 09/2009 435.56 KB
Module Part Numbering Systems:  Part numbering guides for Micron DDR3, DDR, DDR, and SDRAM modules. 02/2012 41.77 KB
PCN/EOL Systems:  Explains Micron's product change notification and end-of-life systems. CSN-12 08/2009 75.58 KB
Wafer Packaging and Packaging Materials:  Provides complete shipping and recycling information about each of the materials used for shipping Micron's products. CSN-20 09/2011 776.24 KB
Bare Die SiPs and MCMs:  Describes design considerations for bare die SiPs and MCMs. CSN-18 04/2009 151.06 KB
Shipping Quantities:  Provides tables of part quantity. CSN-04 10/2011 463.55 KB
Micron Component and Module Packaging:  Explanation of Micron packaging labels and procedures. CSN-16 02/2012 840.61 KB
ESD Precautions for Die/Wafer Handling and Assembly:  Describes the benefits of controlling ESD in the workplace, including higher yields and improved quality and reliability, resulting in reduced manufacturing costs. CSN-24 08/2010 119.08 KB
Electronic Data Interchange:  Describes EDI transmission sets, protocol, and contacts. CSN-06 09/2005 53.5 KB
RMA Procedures for Packaged Product and Bare Die Devices:  Outlines standard returned material authorization (RMA) procedures, as well as the differences associated with bare die RMAs. CSN-07 10/2010 82.64 KB
ISO System Management Standards:  Describes ISO system management standards. CSN-08 04/2004 39.18 KB
Competitive DDR Memory Subsystems:  DDR milestones and platform design 12/2009 2.64 MB
DDR System Design Considerations:  DDR overview 12/2009 3.46 MB
The Future of Memory and Storage:  Overview of trends for main memory and Flash memory 12/2009 1.54 MB
Design Guide for Two DDR3-1066 UDIMM Systems:  Rev. B, Design guide to assist board designers implementing products using UDIMM systems TN-41-08 01/2010 1.1 MB
Moisture Absorption in Plastic Packages:  Describes shipping procedures for preventing memory devices from absorbing moisture and recommendations for baking devices exposed to excessive moisture TN-00-01 02/2010 87.26 KB
Accelerate Design Cycles with Simulation Models:  Micron supplies the tools and guidelines necessary to verify new designs prior to layout. This technical note discusses software model support, signal integrity optimization, and logic circuit design. TN-00-09 02/2010 206.91 KB
Micron Wire-Bonding Techniques:  This technical note provides guidance on wire bonding techniques for both nickel-palladium (NiPd) and aluminum (Al) bond pads on Micron products. TN-00-22 11/2010 66.13 KB
Micron BGA Manufacturer's User Guide:  Provides information to enable customers to easily integrate both leading-edge and legacy Micron's ball grid array (BGA) packages into their manufacturing processes. It is intended as a set of high-level guidelines and a reference manual describing typical package-related and manufacturing process-flow practices. CSN-33 07/2011 353.32 KB
Proper Handling Procedures for Micron DIMMs:  12/2009 396.18 KB
Proper Installation Procedures for Micron DIMMs:  12/2009 419.89 KB
Proper Handling of Micron DIMMs - Japanese:  12/2009 453.96 KB
Proper Installation of Micron DIMMs - Japanese:  12/2009 394.2 KB
Proper Handling of Micron DIMMs - Simplified Chinese:  12/2009 482.47 KB
Proper Installation of Micron DIMMs - Simplified Chinese:  12/2009 592.58 KB
Proper Handling of Micron DIMMs - Spanish:  12/2009 461.82 KB
Proper Installation of Micron DIMMs - Spanish:  12/2009 546.81 KB
Proper Handling of Micron DIMMs - Traditional Chinese:  12/2009 539.92 KB
Proper Installation of Micron DIMMs - Traditional Chinese:  12/2009 758.93 KB
DDR Registered DIMM Design Standard:  PC1600/2100 Rev 1.2 12/2009 537.31 KB
JEDEC Mechanical Dimensions:  184-Pin DIMM 08/1998 301.7 KB
Product Marks/Product and Packaging Labels:  Explains product part marking, and product and packaging labels. CSN-11 02/2012 666.83 KB
Bypass Capacitor Selection for High-Speed Designs:  Describes bypass capacitor selection for high-speed designs. TN-00-06 03/2011 481.9 KB

Please Note: To view Secure Documents (Secure Lock) please log in or click on a secured document to request access.

Can Vtt and Vref be supplied by the same supply in my system design?
With proper decoupling this can be an acceptable design. However, Micron recommends ensuring all supplies are separated. Vref tends to have more noise on it because it supplies signals that are regularly switching. A robust design would typically not connect these supplies due to the possibility of introducing this noise onto the Vtt plane which should be as stable as possible. Additionally, Vref requires much less current than Vtt.
Is there a set of trace lengths and routing rules that are standard for use when designing a system that uses a specific module technology and form factor?
No. A robust memory subsystem design that includes the use of 1 or more memory modules must be simulated in order to determine the optimum trace lengths, terminations. However, our design guides such as TN-47-01 and TN-41-08 have some best practices and design examples based on some typical system assumptions. This information is not meant to be the only way your system can be designed. It is a starting point and moreover an example of the steps used to determine the best design for your system.

RDIMM

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